Products
Modules for Academic and Industrial R&D

Modules for Academic and Industrial R&D

JadeMat-WBG

Wide Band Gap

By integrating 3D Raman spectrum imaging and nonlinear high-speed Imaging module makes JadeMat-WBG a great tool for finding defects in depth. High-speed 3D inspection technology efficiently identifys defects and lattice dislocations in compound semiconductor samples.

Features

  • Surface wafer defect detection :Defects down to 0.01mm, stains detection
  • Surface Al+ doping homogeneous inspection for GaN epi-wafer
  • Inside Strain and lattice dislocation analysis: Penetration depth greater than 10 µm
  • Surface strain analysis
  • Inspection item :Bow/warp, surface defects, strain analysis, Doping uniformity, stress analysis at specific depths
  • TCP / IP communication interface
  • 3rd Party Development Kit
  • Convenient super-resolution upgrade module

Specifications

#FIRST NAMELAST NAMEUSER NAMEDATE
Suitable sampleGaN, AlGaN, SiC, GaAs, InP,etc.
Max. resolution1 µm
Spectral resolution0.3 nm
Applicable laser wavelength440 mm x 440 mm x 500 mm
Module size224 nm - 1550 nm
Applicable Laser for SHG imaging700 nm - 1550 nm
SHG imaging moduleNonpolarized / Vertical / Horizontal polarization

Expansion Module

  • Super-resolution upgrade module
  • TRPL inspection module

Contacts

+886-2-2697-5562
+886-2-2697-3927
service@southport.com.tw
18F-1, No. 95, Sec. 1, Xintai 5th Rd., Xizhi Dist., New Taipei City,Taiwan
南方科技股份有限公司 Southport Corporation
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