Academic And Industrial R&D Professional Inspection System

JadeMat-WBG

Wide Band Gap : 2-in-1 3D Defect and Stress Inspection

JadeMat-WBG is an integrated 3D nondestructive inspection system capable of filling the gap in discovering, identifying, and characterizing the intrinsic properties of defects and stresses for wide-bandgap (WBG) materials. The system can shed light and help researchers and engineers gain a deeper insight into the root causes of problems unseen and unfound before. Southport JadeMat-WBG system can help WBG manufacturers to achieve significant cost reductions by introducing it to their process RD, quality RD, and production line.

Features

2” / 4” / 6” / 8” 3D defect mapping
2” / 4” / 6” / 8” 3D stress mapping
Micro area 3D defect imaging
Micro area 3D stress imaging
Section view of defect distribution
Section view of stress distribution
3D Colocalization of stress and defect

Specifications

#	FIRST NAME	LAST NAME	USER NAME	DATE
Available samples		SiC substrate, SiC on SiC, GaN on Si, GaN on SiC, GaN substrate
Available wafer size		2", 4", 6", 8"
Whole wafer defect scan speed		1.5 hrs / layer @4” wafer
Whole wafer defect scan lateral resolution		1 μm
Micro area defect FOV		400 μm
Micro area defect scan resolution		Up to 1024 x 1024
Whole wafer stress scan speed		40 mins / layer ( @4" wafer, 2 mm step size )
Whole wafer stress mapping axial resolution		1 μm
Micro area stress mapping FOV		250 μm
Micro area stress mapping resolution		Up to 512 x 512

Contacts

+886-2-2697-5562

+886-2-2697-3927

info@southport.com.tw

18F-1, No. 95, Sec. 1, Xintai 5th Rd., Xizhi Dist., New Taipei City,Taiwan

南方科技股份有限公司 Southport Corporation