Non-contact 3D Stress Inspection and Analysis System for WBG Materials
▪ Effectively reflect the intrinsic property of WBG materials ‒ stress distribution on surface and in depth ▪ Good for monitor the stress distribution and polytype uniformity of SiC substrate, homogeneous and heterogeneous epi wafer, and device process review
# | FIRST NAME | LAST NAME | USER NAME | DATE |
---|---|---|---|---|
Available samples | SiC substrate, SiC on SiC, GaN on Si, GaN on SiC, GaN substrate | |||
Available wafer size | 2", 4", 6", 8" | |||
Inspection item | Whole wafer stress mapping, Micro area stress mapping, Polytype Detection (4H, 6H, 3C SiC) | |||
Whole wafer stress scan speed | 40 mins / layer ( @4" wafer, 2 mm step size ) | |||
Whole wafer stress mapping axial resolution | 1 μm | |||
Micro area stress mapping FOV | 250 μm | |||
Micro area stress mapping resolution | Up to 512 x 512 |
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